In the ever-evolving landscape of chip packaging technology, Intel has set its sights on an ambitious endeavor: crafting a chip housing a staggering trillion transistors by 2030. This audacious goal aligns with the trajectory of Moore’s law, which initially proposed a doubling of transistors annually, a concept fostered by Fairchild Semiconductor and later championed by Intel. However, over time, this exponential growth slowed to a three-year cycle.
Key Points:
Intel’s Trillion-Transistor Chip Goal by 2030:
Objective: Crafting a chip with a trillion transistors by 2030, doubling transistor count yearly akin to Moore’s law.
Moore’s Law Slowdown: Moore’s law’s original pace slowed to a three-year doubling cycle over time.
“Super Moore’s Law” Vision:
Intel’s Vision: Intel aims to surpass Moore’s Law by 2031, introducing “Super Moore’s Law” or “Moore’s Law 2.0.”
Strategic Collaborations: TSMC and Samsung Foundry collaborations are crucial in this pursuit.
Industry Transition: Qualcomm’s shift to TSMC and Samsung Foundry signifies a broader industry shift.
Challenges and Strategies:
Rate of Doubling Transistors: Acknowledgment of a slower doubling rate every three years.
Technology for Trillion Transistors: Strategies like advanced packaging and RibbonFET technology are employed for increased transistor integration.
Economic Realities: Intel’s considerable investment, with modern fabrication facility costs doubling to $20 billion.
Trillion-Transistor Milestone:
Intel’s Aspiration: Integrating a trillion transistors within a chip isn’t new, reflecting a gradual scaling slowdown.
Diverse Technological Approaches: RibbonFET technology and PowerVIA Power Delivery among methods for increased transistor density.
Economic Impact: Escalating costs – fabrication facility expenses doubled from $10 billion to $20 billion.
The post Intel’s Vision: Pioneering Trillion-Transistor Chips Defying Moore’s Law Boundaries by 2030 appeared first on Before You Take.