Samsung is preparing to make a significant leap in mobile chipset technology with the upcoming Exynos 2600 System-on-Chip (SoC). A recent report suggests that this next-gen processor will incorporate a new copper-based Heat Pass Block (HPB) component to significantly improve thermal performance. This move could bring Samsung’s in-house chips closer to competing with Qualcomm’s dominant Snapdragon lineup, particularly in terms of heat management and GPU performance.

Key Points

Samsung Exynos 2600 to include Heat Pass Block (HPB) for thermal efficiency

Built using Samsung’s 2nm process technology

Likely to power the Galaxy S26 series in 2026

Expected to outperform Snapdragon 8 Elite in GPU tests

CPU scores still lag slightly behind Snapdragon counterparts

Final testing of Exynos 2600 expected by October 2025

Advanced Cooling with Heat Pass Block

According to ZDNet Korea, Samsung has developed a custom copper Heat Pass Block that will be embedded directly into the semiconductor package of the Exynos 2600 SoC. This new component is designed to work alongside the DRAM module and aims to facilitate faster and more effective heat dissipation from the processor. By placing this material closer to the chip, Samsung is hoping to eliminate the overheating issues that have affected previous Exynos processors.

2nm Process and Packaging Innovation

The Exynos 2600 is being fabricated on Samsung’s next-generation 2nm process node, promising improved power efficiency and performance. In addition to the HPB, Samsung will likely continue using package-on-package (PoP) and fan-out wafer-level packaging (FOWLP) technologies, both of which have been used in prior Exynos chipsets.

Benchmark Performance

Early Geekbench results for a test device labeled S5E9965—believed to house the Exynos 2600—showed promising scores of 2,155 (single-core) and 7,788 (multi-core). While these numbers are slightly lower than the current Snapdragon 8 Elite CPU scores, 3DMark GPU benchmark leaks suggest that the Exynos 2600 may have an edge in graphics performance.

Competition and Timeline

Despite the advancements, Samsung may still face stiff competition. Qualcomm’s next-generation Snapdragon 8 Elite 2 is expected to be unveiled in September 2025, potentially offering even better overall performance. However, Samsung plans to complete final testing of the Exynos 2600 by October, indicating that the chipset could be ready in time for the early 2026 launch of the Galaxy S26 series.

Conclusion

With the inclusion of the innovative Heat Pass Block component and cutting-edge 2nm manufacturing process, the Exynos 2600 is shaping up to be Samsung’s most advanced chipset yet. While CPU performance still trails Qualcomm’s offerings, the gains in GPU power and thermal efficiency could make the Exynos 2600 a compelling choice in future flagship smartphones. Whether it can finally close the gap with Snapdragon remains to be seen, but Samsung’s commitment to innovation is clearly on display.

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