Samsung Exynos 2600 May Finally Solve Overheating Issues with New Heat Pass Block Technology
Samsung is preparing to make a significant leap in mobile chipset technology with the upcoming Exynos 2600 System-on-Chip (SoC). A recent report suggests that this next-gen processor will incorporate a new copper-based Heat Pass Block (HPB) component to significantly improve thermal performance. Continue reading Samsung Exynos 2600 May Finally Solve Overheating Issues with New Heat Pass Block Technology