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MediaTek<\/strong><\/a> is preparing to make another leap in mobile chip innovation. Following the recent launch of the <\/span>Dimensity 9400+, leaks surrounding its upcoming <\/span>Dimensity 9500 SoC have begun circulating online, revealing key architectural upgrades, cutting-edge manufacturing techniques, and a renewed focus on AI and graphics performance. Here\u2019s everything we know so far about this next-gen flagship chipset.<\/span><\/p>\n \u00a0<\/p>\n \u00a0<\/p>\n Based on TSMC\u2019s N3P 3nm process<\/span><\/strong><\/p>\n New Immortalis-Drage GPU with better ray tracing<\/span><\/strong><\/p>\n All-large core architecture with ARM X9 and A7 series<\/span><\/strong><\/p>\n AI-focused NPU 9.0 with up to 100 TOPS<\/span><\/strong><\/p>\n Supports LPDDR5X RAM and UFS 4.1 storage<\/span><\/strong><\/p>\n Sticking to 3nm due to Apple\u2019s early access to 2nm tech<\/span><\/strong><\/p>\n \u00a0<\/p>\n One of the standout highlights of the <\/span>Dimensity 9500 is its use of <\/span>TSMC\u2019s N3P process\u2014a second-generation 3nm node that promises significant improvements in power efficiency and performance. This move makes MediaTek one of the few chipmakers working at the forefront of 3nm architecture, joining the ranks of Apple<\/a> and Qualcomm<\/a> in adopting cutting-edge silicon technology.<\/span><\/p>\n \u00a0<\/p>\n According to prominent leaker <\/span>Digital Chat Station<\/a>, the Dimensity 9500<\/a> will utilize an <\/span>all-big core architecture consisting of:<\/span><\/p>\n \u00a0<\/p>\n 1x Travis Core (likely ARM Cortex-X9)<\/span><\/p>\n 3x Alto Cores (also part of the new X9 family)<\/span><\/p>\n 4x Gelas Cores (next-gen ARM A7 large cores)<\/span><\/p>\n \u00a0<\/p>\n This design showcases a significant departure from traditional big.LITTLE configurations. All cores are now performance-focused, likely improving multi-core throughput and overall performance for high-end smartphones.<\/span><\/p>\n \u00a0<\/p>\n On the graphics front, the <\/span>Immortalis-Drage GPU will succeed its predecessor with a <\/span>re-engineered microarchitecture that enhances <\/span>ray tracing capabilities while cutting back on power consumption. This means smoother visuals and more realistic lighting and shadows in mobile gaming\u2014an area where MediaTek is clearly pushing boundaries.<\/span><\/p>\n \u00a0<\/p>\n The <\/span>Dimensity 9500 will feature an upgraded <\/span>NPU 9.0, designed to deliver impressive AI performance estimated at <\/span>up to 100 TOPS (trillion operations per second). This level of AI processing power could be instrumental for real-time voice processing, advanced image recognition, on-device generative AI, and more.<\/span><\/p>\n \u00a0<\/p>\n To complement this, MediaTek is pairing the chip with:<\/strong><\/p>\n \u00a0<\/p>\n 16MB of L3 cache<\/p>\n 10MB of SLC (System Level Cache)<\/p>\n Support for <\/span>LPDDR5X RAM with speeds up to <\/span>10,667 Mbps<\/p>\n Support for <\/span>quad-channel UFS 4.1 storage<\/p>\n \u00a0<\/p>\n This hardware combination points to ultra-fast performance, smooth multitasking, and faster app and data access for flagship smartphones.<\/span><\/p>\n \u00a0<\/p>\n Originally, MediaTek was planning to shift to <\/span>TSMC\u2019s<\/a> upcoming 2nm process, but <\/span>cost limitations and <\/span>Apple\u2019s early production reservation for the <\/span>A20 Pro chip\u2014expected to power the <\/span>iPhone 18 series in 2026\u2014meant the chipmaker had to adjust its strategy. As a result, the Dimensity 9500 will remain on the <\/span>3nm N3P node, which still offers industry-leading performance and efficiency.<\/span><\/p>\n \u00a0<\/p>\n While there is no official confirmation yet, the <\/span>Dimensity 9500 is expected to debut in flagship smartphones from <\/span>OPPO, Vivo, Xiaomi, and iQOO later this year or early 2026. Given MediaTek\u2019s recent collaborations, it\u2019s likely that the new SoC will be paired with premium camera hardware, high-refresh-rate AMOLED displays, and robust gaming features.<\/span><\/p>\n \u00a0<\/p>\n With the <\/span>Dimensity 9500, MediaTek appears ready to challenge Qualcomm and Apple on all fronts\u2014from raw power and ray tracing to advanced AI processing and memory bandwidth. If the leaked specs are accurate, this chipset could redefine what Android flagship phones are capable of.<\/span><\/p>\n \u00a0<\/p>\n Stay tuned for more updates as we get closer to the official announcement.<\/span><\/p>\n \u00a0<\/p>\n Latest Technology News | Updates<\/a> | Latest Electric Vehicle News | Updates<\/a> | Electronics News<\/a> | Mobile News | Updates<\/a> | Software Updates<\/a><\/p>\n \n Facebook<\/a> | Twitter<\/a> | WhatsApp Channel<\/a> | Instagram<\/a> | Telegram<\/a> | Threads<\/a> | LinkedIn<\/a> | YouTube<\/a><\/p>\n \u00a0<\/p>\n Stay informed, Stay Connected!<\/p>\n The post MediaTek\u2019s Dimensity 9500 Details Leaked: 3nm Chip with X9 Cores, Immortalis GPU & 100 TOPS AI Unveiled<\/a> appeared first on Before You Take<\/a>.<\/p>","protected":false},"excerpt":{"rendered":" \u00a0 MediaTek is preparing to make another leap in mobile chip innovation. Following the recent launch of the Dimensity 9400+, leaks surrounding its upcoming Dimensity 9500 SoC have begun circulating online, revealing key architectural upgrades, cutting-edge manufacturing techniques, and a renewed focus on Continue reading MediaTek\u2019s Dimensity 9500 Details Leaked: 3nm Chip with X9 Cores, Immortalis GPU & 100 TOPS AI Unveiled<\/span>Key Points:<\/h1>\n
Manufactured on TSMC\u2019s Advanced 3nm N3P Node<\/h2>\n
New Performance Core Configuration: Travis, Alto, and Gelas<\/h2>\n
Immortalis-Drage GPU: Ray Tracing Redefined<\/h2>\n
Advanced AI and Memory Architecture<\/h2>\n
Why MediaTek Stuck to 3nm<\/h2>\n
Expected Devices and Launch Timeline<\/h2>\n
Conclusion:\u00a0<\/h1>\n
Follow Before You Take<\/a> on:\u00a0<\/span><\/h3>\n