MediaTek Announces Dimensity 7300 and 7300X SoCs with Advanced AI and Gaming Features: Full Specs and Expected Smartphone Integrations


MediaTek has officially unveiled the MediaTek Dimensity 7300 and Dimensity 7300X chipsets, set to power the next generation of mid-range smartphones. These new SoCs promise impressive performance and energy efficiency, leveraging advanced manufacturing technology and cutting-edge features.


MediaTek Dimensity 7300 and Dimensity 7300X: Key Features and Specifications

The Dimensity 7300 and Dimensity 7300X chipsets are built on an ultra-efficient 4nm process, which contributes to their superior performance and power efficiency. Both chipsets feature an octa-core CPU configuration, including four Cortex A78 cores clocked at 2.5GHz for high performance and four Cortex A55 cores at 2.0GHz for efficiency tasks.


Core Specifications:


CPU: 4x Cortex A78 at 2.5GHz, 4x Cortex A55 at 2.0GHz.


GPU: ARM Mali G615 MC2 GPU.


Memory: Supports LPDDR4x and LPDDR5, with speeds up to 6400Mbps.


Storage: UFS 3.1 for high-speed data transfer.


Display and Camera:


Display: MediaTek MiraVision 955 technology supports Full HD+ resolution with a 144Hz refresh rate, and WFHD+ with a 120Hz refresh rate. The Dimensity 7300X additionally supports dual displays.


Camera: MediaTek Imagiq 950 ISP supports up to a 200MP sensor, 4K video capture at 30fps, hardware face detection, and enhanced video capabilities including HDR and EIS.


AI and Connectivity:


AI: Equipped with MediaTek’s 6th generation APU 655, offering twice the AI computing power of its predecessors.


Connectivity: Comprehensive support including 2G/3G/4G/5G Multi-Mode, 4G and 5G Carrier Aggregation, Bluetooth 5.4, Wi-Fi 6E, and navigation systems like GPS, BeiDou, Glonass, Galileo, QZSS, and NavIC.



MediaTek HyperEngine: Enhanced gaming performance with optimizations and a more powerful GPU, delivering 20% greater FPS and improved energy efficiency compared to competitors.


Expected Smartphones with Dimensity 7300 and 7300X

The newly announced chipsets are expected to debut in upcoming smartphones from notable brands such as Motorola and OPPO.


Motorola: The Motorola Razr 50, a clamshell foldable smartphone, is anticipated to be equipped with the Dimensity 7300X 5G chipset. Early Geekbench listings reveal impressive performance scores, with 1033 points in single-core and 2751 points in multi-core tests.


OPPO: The global variant of the OPPO Reno 12 5G is likely to feature the Dimensity 7300 SoC, offering users a balance of power and efficiency.



MediaTek’s introduction of the Dimensity 7300 and 7300X chipsets marks a significant step forward in the mid-range smartphone segment, delivering top-notch performance, advanced AI capabilities, and robust connectivity options. With smartphones from leading manufacturers like Motorola and OPPO soon to be powered by these chipsets, consumers can expect enhanced mobile experiences with better performance, energy efficiency, and innovative features.



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